Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong. Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).

“The first-hand data indicate that plasma can be used especially for improving platinum-copper (Pl-Cu) interface adhesion and eliminating possible micro-voids between the Cu seed layer and the electrically plated Cu layer during electroplating,” said Zhao. “The use of proper plasma recipes is very important for addressing the challenges of these WLP applications.”