Contaminated printed circuit board assemblies can lead to poor performance. Oils and flux residue can prevent proper adhesion of conformal coatings, while marking inks, adhesives, and other materials can cause PCB delamination, blistering, shorting, dendrite growth, and electrochemical migration. It is therefore critical to remove all leftover manufacturing contaminants and to do it in an environmentally sustainable way. 

Nordson Corp. recently announced that it will demonstrate its latest solutions for semiconductor packaging and electronics manufacturing at SEMICON Taiwan in Taipei.

We rely on electronics for almost every aspect of our daily lives. With the advent of compact components and circuitry, it is difficult to think of many products that do not incorporate electronics in some fashion. What you might not think about is how fragile these electronics can be and how they can become easily damaged or degraded by environmental conditions.

The global market for powder coatings is projected to expand in the coming years, potentially reaching $19.9 billion by 2027.¹ While the powder coating sector is poised for rapid growth, a prerequisite remains: getting the surface right.

Third-party coating, adhesive, and sealant providers benefit greatly from the rigorous testing standards required by their manufacturing partners. While this is a widely adopted norm, the best practice in testing procedures involves incorporating additional quality control and testing standards beyond those requirements.

Cleaning and surface pretreatment are directly related in many industries. Traditional pretreatment methods such as alcohol wiping or air nozzles are used to clean off contaminants and prepare surfaces for adhesion.