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Enercon has adopted various interactive technologies that will allow customers to connect with company experts through video conferencing, collaborative discussions, video demonstrations, and technical presentations.
Bonding in automotive, aerospace, and other assembly operations can be improved through effective surface pretreatment technologies such as carbonic cleaning.
Cleaning and surface pretreatment are directly related in many industries. Traditional pretreatment methods such as alcohol wiping or air nozzles are used to clean off contaminants and prepare surfaces for adhesion.
Most polymers have a low surface energy, which results in difficulties when further processing (e.g., coating, printing, or gluing) and requires the use of surface treatment to increase the surface energy.
PPG recently announced that the U.S. Air Force has qualified PPG Aerocron™ aerospace electrocoat (e-coat) primer to provide corrosion resistance and enhanced topcoat adhesion for aircraft parts.
Visitors to the company’s stand will reportedly have the opportunity to explore five electrode assemblies featuring variations of high-powered ceramic and stainless steel electrodes.
Enercon Industries recently announced that it will showcase hands-on displays that cover its range of corona, plasma, and flame surface treating technologies at K 2019.
Henkel recently announced new REACh-compliant Bonderite products for etch passivation and corrosion protection that are reportedly chromium-free, allow the toxicity labeling to be removed, and reduce the user’s carbon footprint thanks to fewer active steps.
Brian Croke will oversee new product development and the continuous improvement of existing products across all induction cap sealing and surface treating lines for Enercon.
Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
Polytetrafluoroethylene (PTFE) is low-surface-energy plastic that is very difficult to bond. PTFE exclusively comprises fluorine and carbon atoms with no polar atoms such as oxygen or nitrogen.
