With the aim of consolidating their positions on the market, Bodo Möller Chemie Group and Henkel Adhesive Technologies added Switzerland to their collaboration. This expanded partnership centers on thermal interface materials (TIMs). Henkel’s Bergquist® thermal management materials are used to conduct heat away from power electronics, ensuring electronic components remain efficient and work reliably for a long time.

Electronic components, such as processors, generate a great deal of heat. With an extremely low thermal conductivity of 0.025 W/mK, air is one of the least efficient heat conductors. TIMs help dissipate heat from components efficiently, preventing overheating, which could impair performance or shorten component lifespans. TIMs also smooth out any uneven surfaces, tolerance deviations or roughness to create an optimal contact surface reducing thermal resistance and enhancing heat transfer. 

Widening its cooperative partnership with Henkel Adhesive Technologies, Switzerland, allows Bodo Möller Chemie to extend its portfolio in the electrical and electronics industry segment to include TIMs of the Bergquist brand. The Bodo Möller Chemie cutting competence center offers a cutting service designed especially for Bergquist materials. 

“The cooperative partnership with Henkel Adhesive Technologies allows us to assist and advise our Swiss customers regarding the optimum TIM for their application. We use a plotter so that we can deliver precise, customized parts for samples or series production,” said Philipp Capol, site director, Switzerland, Bodo Möller Chemie. 

The in-house cutting competence center cuts thermally conductive materials using a kiss-cut or through-cut work process. Quality assurance is then carried out with suitable measuring instruments, which check components and perform optical measurements. This allows for almost all contours and production to be replicated at all development stages, from prototypes through to series manufacture.

To learn more, visit www.bm-chemie.com and www.henkel.com.