Mitsubishi Chemical Corp. to Commercialize New Negative Thermal Expansion Filler
Negative thermal expansion filler (powder).
Mitsubishi Chemical Corp. is commercializing a new negative thermal expansion filler that contracts when heated, developed for semiconductor packaging materials. The company announced it will begin selling pilot products by the end of FY2026, proceed with customer evaluations and certifications, and launch sales of mass-produced products in the second half of FY2027.
The filler will be marketed under the brand name M-Filleris™ NTE. The company also plans to add other functional fillers with performance features such as heat dissipation and electrical properties to the lineup as the M-Filleris series.
Epoxy resins and silica fillers are widely used in semiconductor packaging to control warpage, but filler content is reaching practical limits. In order to further reduce thermal expansion, Mitsubishi developed a negative thermal expansion filler that contracts when heated.
Features of the product include reduced thermal expansion when compounded in epoxy resins, negative thermal expansion characteristics over a wide temperature range from room temperature to 400 °C, excellent fluidity and dispersibility due to its spherical shape, low alpha particle emission through impurity control, and specific gravity and low water absorption comparable to general semiconductor fillers.
Learn more at mcgc.com.
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