Adhesives & Sealants Headlines

TAPPI’s Symposium to Focus on Hot Melts in the 21st Century

ATLANTA — TAPPI’s 2001 Hot Melt Symposium will be held June 10 –13, 2001, at the Westin on Hilton Head Island, S.C. This year’s technical program theme, 2001 – A Hot Melt Odyssey, focuses on the processes and methods required to ensure the successful adaptation of hot melts in the 21st century marketplace.

A sampling of this year’s session topics include: Stage Gate – a Process for New Product Commercialization; The Use of Hot Melts as a Sealant; The Combined Hot Melt Chemistries and Their Synergistic Effects in Performance and Cost; and The Market Potential of Hot Melts in the United States, Europe, and the Far East.

A Back to Basics tutorial on Sunday will encompass a review of raw materials in general, the formulation and function of raw materials for hot melt adhesives, and the required processing equipment. The Hot Melt Adhesives Test Methods Workshop will be held on Wednesday and will cover the performance of both pressure sensitive and non-pressure sensitive hot melt adhesives.

For more information, contact TAPPI at 800-332-8686, or visit www.tappi.org.

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