ND Industries: Water-Based Micro-Encapsulated Adhesive
September 11, 2000
ND Microspheres® 294 is a water-based, micro-encapsulated epoxy designed to be preapplied to threaded fasteners. As a water-based compound, the product’s slurry contains no harmful elements that could evaporate into the atmosphere. Once applied, the adhesive remains inert until the shearing action of engagement to the mating part causes some of the capsules to break, allowing it to cure. A limited number of reuses are possible, and it will also seal against oil, water, fuels and a wide range of motor fluids.