After three years of research and nearly $1 million spent in volunteer time and contributions, the IPC Solder Products Value Council has announced the release of its Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper - Final Report. The 50-page analysis, along with 18 appendices representing nearly 60 MB of data, includes conclusions on thermal shock and temperature-cycle reliability testing of the tin/silver/copper (SAC) lead-free alloy family. The study also includes detailed information on voiding and performance differences between tin/lead and the SAC alloys, as well as performance of PCBs and components.

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