Dymax OP-30 opto-mechanical assembly adhesive minimizes movement of critical components during curing and subsequent thermal cycling. With a modulus of elasticity of 2,500 psi, the adhesive eliminates strain while maintaining high-strength bonds to metal, glass and plastics. The product also features high ionic purity for applications requiring low extractables and applications for opto-electronic assembly. Formulated to cure in seconds upon exposure to UV/visible light, OP-30 exhibits excellent depth and speed of cure.