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MASTER BOND: Low-Viscosity Epoxy
October 25, 2004
Master Bond Inc. has introduced EP30P, a new two-component, transparent, low-viscosity epoxy system for high-performance bonding, sealing, coating, encapsulation and casting. The system has a 4 to 1 mix ratio by weight and is formulated to cure at room temperature. Cures can be accelerated through the use of heat. EP30P bonds well to a variety of substrates, including metals, glass, ceramics and many plastics. It has a service operating temperature range of -60 degrees F to +250 degrees F. EP30P is a 100 percent reactive system and contains no solvents or diluents. It has exceptionally low linear shrinkage upon cure and offers outstanding electrical insulation properties.