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Cotronics: Resbond Low Expansion Adhesive
August 12, 2003
The Resbond 905 2,500 degrees F is an adhesive designed to bond low expansion materials for use in difficult applications. It is easy use by just mixing and applying. Resbond 905 cures to form an electrically and chemically resistant bond that will prevent cracking in thermal shock applications. It has strong adhesion to quartz, fiber optics, corderite, fused silica, lithium-alumina silicates, glassware, ceramics and more. It is packaged in pint size trial kits, complete with data sheets, instructions and the company's "high Temperature Materials" handbook.