ProFlex technology, introduced by DEK, will enable high accuracy mass imaging to surpass resolutions of 150 mm in commercial volumes. It will be available as a factory fitted option for new machines, and as a machine performance upgrade (MPU) to machines already in the field. It is the result of in-depth studies into stencil behavior during the separation phase. Because stencil separation has a significant impact on paste release, its influence over stencil cleaning requirements is particularly critical for very small apertures. The need to invoke frequent stencil cleaning cycles reduces throughput. By changing the stencil's behavior during separation, it minimizes aperture blocking to reduce the number of stencil cleaning cycles.

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