Multicore[R] MP200 is a no-clean solder paste that is suitable for fine-pitch, high-speed printing applications. The product is a high-activity, soft, colorless, low-residue solder paste that exhibits excellent print definition with long open- and abandon-time capabilities for manufacturing facilities that have frequent set-ups. The high activity of the MP200 flux offers excellent wetting to a wide range of surface finishes, and an exceptional reflow process window. Circle No. 217