SMT manufacturing experts will explore the day's leading lead-free SMT manufacturing process challenges in a free, live webcast seminar set for Thursday, Feb. 17, 2005 at 11:00 EST. The one-hour webinar, to be presented by Speedline Technologies, will focus on the electronics industry's move to lead-free assemblies. Process issues abound throughout the industry as companies begin removing hazardous lead from electronic packages and reducing the dependency on lead materials that can leach into the environment during processing or disposal. The global effort is driven by environmental considerations, governmental legislation and the marketing advantages of lead-free electronic packages.

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