Q-BI58 is composed of 42% tin and 58% bismuth (known as Sn42/Bi58) lead-free wire solder. Q-BI58 is a recommended lead-free soldering alternative for heat-sensitive components that require a low melting point. The low melting point prevents thermal degradation of heat-sensitive components. The alloy meets or exceeds J-STD-006 requirements and all other relevant international standards.
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