A highly thermally conductive epoxy system designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits is now available. With a thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60 to 400°F, EP21ANHT reportedly delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive can also be used as an electrical insulator.

The two-component adhesive, sealant and coating features a 1:1 mix ratio by weight or volume, and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of > 400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a range of chemicals and adheres well to a variety of substrates.

For more information, visit www.masterbond.com.