MASTER BOND: Conductive Epoxy
The two-component adhesive, sealant and coating features a 1:1 mix ratio by weight or volume, and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of > 400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a range of chemicals and adheres well to a variety of substrates.
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