Adhesives Mag logo
search
cart
facebook twitter linkedin youtube
  • Sign In
  • Create Account
  • Sign Out
  • My Account
Adhesives Mag logo
  • NEW PRODUCTS
  • NEWS
    • Adhesives & Sealants Headlines
    • Mergers/Acquisitions
    • Events Calendar
    • Market Trends
  • TOPICS
    • Finished Adhesives and Sealants
    • Pressure-Sensitive Adhesives (PSAs)
    • Coatings
    • Raw Materials and Chemicals
    • Materials Handling/Processing
    • Meter/Mix/Dispense
    • Curing
    • Testing/Quality Control
    • Packaging of Adhesives & Sealants
    • Converting/Packaging
    • Composites
    • Sustainability
  • COLUMNS
    • European Perspectives
    • Strategic Solutions
    • Supply Chain Strategies
    • Tape Talk
  • TOP 20
  • MULTIMEDIA
    • Videos
    • Podcasts
    • Webinars
    • eBooks
  • EXPLORE
    • Adhesives in Action
    • Blog
    • ASI Store
    • Industry Links
    • Market Research
    • Classifieds
  • DIRECTORIES
    • Buyers' Guide
    • Global Adhesives & Sealants Directory
    • Raw Materials, Chemicals, Polymers and Additives Handbook
    • Equipment Handbook
    • Distributor Directory
  • EMAGAZINE
    • EMAGAZINE
    • ARCHIVE ISSUES
    • ADVERTISE
      • Custom Content & Marketing Services
    • CONTACT
  • SIGN UP!
NewsAdhesives & Sealants HeadlinesFinished Adhesives and Sealants

Dow Corning Sees Collaboration in Materials and Processing Technology as Critical to the Semiconductor Industry’s Recovery

Headlines.jpg
July 12, 2013

Semiconductor sales appear to be finally emerging from the red this year, with moderate but steady growth of 5.1% projected through 2014, according to World Semiconductor Trade Statistics’ Spring 2013 global semiconductor sales forecast. While a revival in end-market demand is sparking much of this growth, Dow Corning reportedly sees collaborative advances in materials and processing technologies as a sustaining force in the industry’s recovery.

“The pace of innovation across the semiconductor processing and packaging value chain has never been greater and, while the industry hasn’t reported any insurmountable challenges ahead for advancing such promising technologies as 3D IC integration, several critical needs are emerging among our global semiconductor customers that we are addressing head on,” said Andrew Ho, global industry director for Advanced Semiconductor Materials. “Among these needs is the steadily accelerating demand for high-performance silicone solutions to help collaborators along the value chain to manage the impact of heat and stress, while reducing overall systems costs wherever possible.”

Specifically, Dow Corning sees growing demand for innovative new silicone solutions able to address the following industry-wide challenges.

  • Improved heat management:  The trend toward ever-smaller devices with more densely packed electronic components is coinciding with the expanding use of flip chip and stacked die architectures. As a result, the industry is seeking improved thermal management from advanced silicone technologies that effectively dissipate heat and deliver greater device reliability and longer life.
  • Enhanced stress passivation:  The rapid growth of wafer-level packaging and power electronics is posing new manufacturing challenges for stress mitigation. At issue is thermo-mechanical stress failure caused, in part, by conventional organic passivation materials. This has prompted new explorations in photo-patternable silicone solutions that help minimize thermo-mechanical stress during processing, and deliver higher thermal stability and low temperature cure.
  • Lower systems costs:  Minimizing total cost of ownership is essential for all semiconductor manufacturing applications. But it is a key enabler for next-generation technologies, such as 3D IC integration built on ultra-thin active wafers. These wafers are temporarily bonded to a carrier wafer before being thinned; yet most temporary bonding solutions require costly pre-treatment and specialized chambers. Recent industry collaborations, however, have successfully fielded a simpler, more cost-effective temporary bonding solution based on silicone adhesive and release layers. The breakthrough technology now enables room-temperature bonding and debonding of active and carrier wafers using conventional manufacturing methods.

“After decades of serving the semiconductor manufacturing industry, Dow Corning recognizes that few if any companies can single-handedly anticipate the next-generation of semiconductor solutions,” said Ho. “Our strong leadership position in this industry is directly linked to our long history of close collaboration with semiconductor manufacturers to develop breakthrough silicone technologies, and we are committed to continuing our history of proactively collaborating with customers to solve their most pressing challenges and help drive the industry forward.”

 

For additional information, visit www.dowcorning.com.

KEYWORDS: adhesives in electrical/electronic semiconductors

Share This Story

Looking for a reprint of this article?
From high-res PDFs to custom plaques, order your copy today!

Recommended Content

JOIN TODAY
to unlock your recommendations.

Already have an account? Sign In

  • mouse in hole

    Using Foam Sealants for Pest Prevention

    According to the National Pest Management Association,...
    Adhesives and Sealants Topics
    By: Kevin Corcoran
  • linked network nodes

    Using the Power of AI for Adhesive and Sealant Formulation

    With the help of software solutions, adhesive formulators...
    Adhesives and Sealants Topics
    By: Karen Parker
  • top20-hero.jpg

    2024 ASI Top 20: Leading Global Manufacturers of Adhesives and Sealants

    ASI's annual ranking of the top 20 global adhesive and...
    Pressure-Sensitive Adhesives (PSAs)
Manage My Account
  • eMagazine Issues
  • eNewsletter
  • Online Registration
  • Manage My Preferences
  • Subscription Customer Service

More Videos

Popular Stories

Picture of three men and one woman cutting a ribbon

H.B. Fuller Opens Adhesives and Sealants Facility in UAE

Picture of Noelle Sieradzki

Mactac Announces Changes to Leadership Team

Aerial view of Bostik manufacturing facility

Bostik Invests in Added Capacity at Massachusetts Manufacturing Plant

ASI Top 20 website

Events

January 1, 2030

Webinar Sponsorship Information

For webinar sponsorship information, visit www.bnpevents.com/webinars or email webinars@bnpmedia.com.

View All Submit An Event

Products

Structural Adhesives: Properties, Characterization and Applications

Structural Adhesives: Properties, Characterization and Applications

See More Products

ASI CASE EBOOK

Related Articles

  • COVID-19

    Is the Housing Industry Poised to Lead the Nation’s Economic Recovery?

    See More
  • STATE OF THE ADHESIVES AND SEALANTS INDUSTRY: A Recovery is in Sight

    See More
  • Electronics_Generic

    North American Printed Circuit Board Industry Sees Spike in Shipments Due to Pandemic

    See More

Related Products

See More Products
  • adhesive-bonding-materials.gif

    Adhesive Bonding: Materials, Applications and Technology

  • adhesive-bonding-science.gif

    Adhesive Bonding: Science, Technology, and Applications

See More Products
×

Keep the info flowing with our eNewsletters!

Get the latest industry updates tailored your way.

JOIN TODAY!
  • RESOURCES
    • Advertise
    • Contact Us
    • Directories
    • Store
    • Want More
  • SIGN UP TODAY
    • Create Account
    • eMagazine
    • eNewsletters
    • Customer Service
    • Manage Preferences
  • SERVICES
    • Marketing Services
    • Reprints
    • Market Research
    • List Rental
    • Survey & Sample
  • STAY CONNECTED
    • LinkedIn
    • Facebook
    • Youtube
    • X (Twitter)
  • PRIVACY
    • PRIVACY POLICY
    • TERMS & CONDITIONS
    • DO NOT SELL MY PERSONAL INFORMATION
    • PRIVACY REQUEST
    • ACCESSIBILITY

Copyright ©2025. All Rights Reserved BNP Media.

Design, CMS, Hosting & Web Development :: ePublishing