Articles Tagged with ''innovation''

3M bonding process center

3M Announces Bonding Process Center Evolution

Formerly known as Global Adhesives Solutions Labs, 3M Bonding Process Centers connect customers with local 3M experts to help solve problems and optimize processes.
September 24, 2021
3M recently announced that its Industrial Adhesives and Tapes Division is evolving its Bonding Process Centers in St. Paul, Minn.; Neuss, Germany; and Shanghai, China.
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event speakers and presenters

Organizers Seek Abstracts for Adhesion Society Annual Meeting

The meeting will be held February 20-23 at the San Diego Mission Bay Hotel.
September 21, 2021
Organizers of the 2022 Adhesion Society Annual Meeting are seeking abstracts for presentations in all areas of adhesion science and technology, with emphasis on sustainability and adhesion, bio-adhesion, soft adhesives, and structural adhesives.
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Awards

DuPont Named Finalist for Two R&D 100 Awards

In the past eight years, DuPont has been named a finalist 17 times and has been the winner of six R&D 100 Awards.
September 1, 2021
DuPont Mobility & Materials has been named a finalist in the annual R&D 100 Awards for two of its solutions in the mechanical/materials category.
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EditorsBlog-Susan
From the Editor

Innovations Abound in the Adhesives and Sealants Industry

From newly developed raw materials and chemicals to finished products and high-tech applications, the adhesive and sealant industry continues to focus on innovation.
Susan Sutton
Susan Sutton
August 24, 2021

From newly developed raw materials and chemicals to finished products and high-tech applications, the adhesive and sealant industry continues to focus on innovation.


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handshake

Henkel Invests in China-Based Material Science Fund

As limited partner of the fund, Henkel will strengthen its access to the fast-growing start-up scene in China.
August 17, 2021
Henkel Adhesive Technologies recently announced that it is strengthening its corporate venture capital activities by investing in the third fund of Richland Capital (Richland Capital Fund III), Beijing, China.
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event speakers and presenters

RadTech 2022 Opens Call for Papers

The event is scheduled for May 10-12, 2022, at the Hyatt Regency Orlando in Orlando, Fla.
August 4, 2021
RadTech International North America recently announced that it is accepting abstracts for the 2022 RadTech UV+EB Technology Conference & Exposition.
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PSTC Seeks Abstracts for Tape Week 2022

The deadline for abstract submissions is September 1, 2021.
July 27, 2021
The Pressure Sensitive Tape Council (PSTC) recently announced the official opening of abstract submissions for its inaugural Tape Week event, slated for May 2-5, 2022, in Lake Buena Vista, Fla.
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