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Zymet SMTA International conference

Zymet and Portland State to Present on Reworkable Adhesives for Wafer-Level Packages at SMTA International Conference

The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
August 23, 2019
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
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Market-Trends

Compostable Food Service Packaging Sales to Grow as Sustainability Push Promises Rapid Adoption

The expansion of the foodservice industry, along with the emergence of “takeaway” and “grab-and-go” services, will continue to provide potential growth prospects for the compostable foodservice packaging market.
August 23, 2019

Worldwide sales of compostable foodservice packaging reached approximately 6,400 tons worth $16.7 million in 2018; the market is projected to grow at a CAGR of around 5% through 2029.


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residential construction

Builder Confidence Trending Higher as Interest Rates Move Lower

The HMI index gauging current sales conditions for newly built single-family homes increased two points to 73, and the component measuring traffic of prospective buyers rose two points to 50.
August 21, 2019
Builder confidence in the market for newly built single-family homes rose one point to 66 in August, according to the latest National Association of Home Builders (NAHB)/Wells Fargo Housing Market Index (HMI).
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Jowat biobased hotmelt adhesives

JOWAT: Bio-Based Hot-Melt Adhesives

According to Jowat, the products feature high renewable raw materials content, which provides high efficiency and cleanliness during processing while facilitating recyclable bonds according to the German packaging law.
August 20, 2019

Jowat recently announced the launch of its new Jowatherm® GROW product range, comprising bio-based hot melts for the environmentally compatible bonding of packaging.


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Case Study

Solving LED Challenges with Silicone Sealants

A silicon sealant coupled with automated dispensing is helping one LED manufacturer enhance product performance and reliability.
August 20, 2019

Based in the UK’s West Midlands, Mackwell Electronics provides technology solutions for the global lighting industry.


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Electronics_Generic

Nordson MARCH Presents Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
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ASHLAND: Offline Primer

The primer was reportedly developed for those customers that pre-optimize paper or film label stock, flexible packaging, and shrink sleeve materials through flexo or gravure.
August 15, 2019
Ashland recently announced that Purekote™ 8020 water-based offline primer for HP Indigo digital inks has joined the company’s portfolio of Rochester Institute of Technology (RIT)-certified overprint varnishes and laminating adhesives.
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