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Home » Topics » Adhesives and Sealants Topics » Finished Adhesives and Sealants

Finished Adhesives and Sealants
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Focus On: Pumping and Metering Advancements

Adhesives can provide a better bond than welding or mechanical fasteners in many cases.
Peter G. Hedger, Jr.
August 5, 2013

The composites industry is full of interesting technologies and products. In the world of composites, diversity can be seen at every turn.


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Bonding Composites: From Performance to Fashion

Adhesive formulators are developing a variety of bonding systems to meet the needs of the dynamic composites industry.
Laurie Gibbons
August 5, 2013

Composite materials, including carbon fiber, are often preferred over conventional materials such as metal because they are lightweight, versatile and resilient.


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Improved Dispensing for Solar Inverters

Automated dispensing can help manufacturers improve quality and lower costs.
Christian Ostermeier
August 5, 2013

Automated dispensing of polyurethane (PU) is often superior to manual silicone dispensing in quality and costs.


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Innovative Dispensing Technology for Material Formulators

Technically advanced dispensing systems continue to evolve for the precision formulating of adhesives and sealants.
David Mandeville
August 5, 2013

Material formulators continue to define and develop new formulations of epoxies, silicones, polyurethanes, and acrylics for their customers’ product assembly applications.


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Advancing Adhesives: School Glues Go Green

Penford Products has teamed up with Elmer’s to develop natural school glues.
August 5, 2013

Penford Products, a division of Penford Corp. and a leading global supplier of specialty bio-products for use in industrial applications including coatings, adhesives and polymers, has announced its support behind the launch of a natural school glue jointly developed with Elmer’s Products Inc.


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PCB Industry Drives Changes in Packaging

Developments in the printed circuit board industry are challenging suppliers to continuously improve quality and processes.
Jim Enochs
August 5, 2013

In the printed circuit board (PCB) industry, manufacturers must drive change or they don’t survive.


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RPM Fiscal 2013 Sales Grow 8%

August 2, 2013
RPM International Inc. recently reported financial results for its fiscal 2013 fourth quarter and year ended May 31, 2013.
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RadTech Seeks Papers for Advanced Materials & Process Conference

August 2, 2013
RadTech recently announced it is seeking abstracts for the 12th biennial RadTech UV & EB Technology Expo and Conference 2014, which will take place May 12-14, 2014.
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AVERY DENNISON LABEL AND PACKAGING MATERIALS: Reclosure Products

August 1, 2013
This company now offers a Select Solutions™ Reclosure portfolio designed to help package designers and packaged goods companies meet consumers’ needs for the convenience that reclosure technology provides.
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Avery Dennison Creates Global Client Service Laboratory

August 1, 2013
Avery Dennison recently announced it has created a Global Client Service Laboratory at its Innovation Center in Mentor, Ohio.
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