Few experiences are richer for adhesive and sealant professionals than attending a WAC. The event offers the complete package: networking, education, exhibition, repeat. On an international level. Like the Olympics, the conference occurs once every four years and rotates between Asia, Europe, and North America. The host association is responsible for organizing and delivering a world-class educational and networking event.
The companies will be integrated into H.B. Fuller’s Construction and Engineering Adhesives business units.
February 2, 2022
H.B. Fuller Co. announced finalization of its purchase of Apollo, a manufacturer of liquid adhesives, coatings, and primers for the roofing, industrial, and construction markets, and the purchase of Fourny nv in Belgium.
Andre Argenton joined Dow in 1999 in Brazil as a research scientist.
February 2, 2022
Dow recently announced that Mary Draves, vice president of Environment, Health and Safety (EH&S) and chief sustainability officer, has announced her decision to retire in April 2022, following more than 32 years of service with the company.
GM reports that this is the single largest investment announcement in the company’s history.
February 1, 2022
General Motors Co. (GM) has announced an investment of more than $7 billion in four Michigan manufacturing sites to significantly increase battery cell and electric truck manufacturing capacity.
Sustainable bonding requires combining the highest possible certified bio-based raw material content in the adhesives, low maintenance and energy requirements in the bonding process, high compatibility of the adhesives with existing application systems, and, especially in the packaging industry, high compatibility in terms of downstream paper recycling. All of this must be achieved at competitive prices.
A new agreement for ActiveCopper™ products will enhance DuPont Microcircuit and Components Materials’ thick film paste portfolio.
January 27, 2022
The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry.