According to Fisnar, user-friendly programming enables a dispense cycle to be quickly created and automatically displayed within minutes.
October 27, 2020
Fisnar recently announced the launch of its new DC50 digital dispense controller, which has been designed specifically to suit simple and general-purpose dispensing applications.
Rotors refined with a so-called “diamond coating” (DC) can reportedly double or triple the lifetime of the system until the rotor must be replaced.
October 8, 2020
preeflow by ViscoTec has developed a solution to significantly improve the service life of the dispensing system when processing highly abrasive materials, especially in small quantity ranges.
According to Scheugenpflug, the multifunctional cell can be used to cover numerous tasks, ranging from potting and the application of liquid seals and adhesives to the sealing of sensitive electronic surfaces.
September 29, 2020
Scheugenpflug recently announced a new cell solution for demanding dispensing tasks.
We have all seen and experienced so many changes over the past few months. COVID-19 has caused a health crisis on a level most of us hadn’t even imagined, beyond the pages of dystopian fiction.
An embedded dual memory processor with CF card reportedly requires no PC for operation and provides all preprogrammed software functions for filling, assembly, positioning, etc.
June 11, 2020
The palletized Dispense Works Inc. RP2415 series production robot reportedly automates the four-component bottle assembly with PD-2 positive displacement twin fill nozzle, dual assembly heads, and a 3-gal pressure pot.
Vacuum potting is mainly aimed at electronic components with small openings and complex internal structures.
June 10, 2020
The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.