A conversion unit enables two-component adhesives to become as simple to use as their single-component counterparts while providing better efficiencies and increased cost savings.
December 20, 2021
A new benchtop dispenser combines the simplicity and versatility of a dual-barrel cartridge with bench-mount support, pneumatic foot pedal, air logic, control panel, and all the equipment needed to convert dual-cartridges to a benchtop potting, encapsulating, bonding, and dispensing system.
Packaging and dispensing systems can help adhesive manufacturers easily and reliably pack their formulations while minimizing waste and allowing end users to efficiently apply the products.
December 13, 2021
The design of packaging and dispensing systems can go a long way in supporting adhesive manufacturers and end users in the pursuit of increased efficiencies. Particularly with the optimal filling and application of 2-component adhesives, it’s fundamental to obtain reliable bonds.
A large contract packaging provider is enjoying a variety of benefits after installing a fully automatic tube filling and sealing system.
December 8, 2021
Sterling Contract Packaging, Inc. (Sterling CPI) of Moore, S.C., is one of the largest providers of contract packaging services in the Southeast. The company provides complete turnkey solutions—from product and package procurement through to the point of distribution—for non-regulated consumer products.
A progressive cavity (PC) pump is a positive displacement pump that facilitates accurate feeding of medium- to high-viscosity materials such as thermal pastes or gels. It ensures minimal waste of material, reducing the environmental impact of the manufacturing process. PC pumps also provide many operational advantages, including continuous flow (doesn’t require reload), constant volume at variable speeds, no pulsation, and low maintenance.
The company featured technologies and products from the Nordson Electronics Solutions and Nordson Test & Inspection divisions.
November 12, 2021
Nordson Corp. recently announced that it showcased solutions for electronics manufacturing, printed circuit board assembly (PCBA), surface mount technology (SMT), and semiconductor packaging at the NEPCON Asia tradeshow in Shenzhen, China.