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Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) that overcomes the drawbacks of older generation ECAs and extends the material’s advantages to multiple applications.

TPO materials present unique bonding challenges for PSA manufacturers due to their low-surface-energy characteristics.

Scientists can use computer-aided design programs to prepare waterborne adhesive formulations.

Composite parts require the right adhesive to achieve optimum performance.

An emerging technology may allow adhesives in opaque substrates to be cured by UV or visible light. 

Cure time for thermically active adhesives can be accelerated by using infrared spot curing.

An optimized LED curing system is essential for process efficiency. 

UV/EB technology enables new manufacturing processes.

Progressive cavity pumps can provide precise, efficient dispensing for a variety of materials.