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ASI and ASC Announce Assembly East Panel Discussion
April 18, 2005
Adhesives & Sealants Industry (ASI) magazine and The Adhesive & Sealant Council (ASC) have announced their participation in this year's Assembly East Educational Program, May 4-5, 2005, at the New Boston Convention and Exhibition Center in Boston, MA. The ASI/ASC panel discussion is entitled "Smart Solutions for Smart Tags: Adhesives and RFID" and will take place on Thursday, May 5 from 11:00 a.m. to 12:00 p.m. The session is part of Assembly East's free Educational Program and is offered at no charge to all registered attendees and exhibitors. ASI Managing Editor Brian Hayes and Pui Chi Wong, Communications Specialist with ASC, will moderate the panel. Scheduled panelists include: Joseph T. Mausar, Marketing & Sales manager, Chemsultants International Inc.; Vito Buffa, market manager, Emerson & Cuming; and Chris Marinelli, director of Application Engineering, Henkel Technologies.