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ASC Presents Adhesives Forum at Assembly Technology Expo
August 12, 2003
The Adhesive and Sealant Council has announced that it will sponsor a new "Adhesive Forum" on Wednesday, Sept. 24, from 10:00 am to 1:00 pm., at Assembly Technology Expo 2003. This half-day session, which will be held in conjunction with the ATExpo exhibition at the Donald E. Stephens Convention Center in Rosemont, IL, is designed to educate end-users about innovations in the adhesives used in various assembly applications. The forum will feature five ASC members discussing different uses of adhesives in assembly applications.