This company has developed a line of 100%-solid adhesive films and die-cut preforms. The products eliminate problems associated with solventborne adhesives such as residual solvent out-gassing, which can affect bond-line integrity due to voiding. The films can be manufactured to a thickness of up to 75 mm. The increased thickness allows these materials to be used as preformed shapes for use as underfills and encapsulants, and in gasketing applications. Circle No. 148