Asymtek’s new SpectrumTMS-920 Series of scalable
dispensing platforms adapt to the needs and requirements of high-volume
microelectronics manufacturing and printed circuit board assembly, such as
corner bonding, flip chip, and CSP underfill. The
system can be configured with single or dual lanes, and one, two, or three heat
stations depending on capacity, process control, and footprint
requirements. Its slim system footprint of 600 x 1321mm
(23.6 x 52.0 in.) maximizes floor space utilization and lowers cost of
ownership. Innovative to the S-920N are a Rapid Response
HeaterTMsystem and Controlled Process Heat
(CpHTM) function as well as multiple systems supporting
closed-loop dispensing process control.
For more information, visitwww.asymtek.com.