Asymtek’s new SpectrumTMS-920 Series of scalable dispensing platforms adapts to the needs and requirements of high-volume microelectronics manufacturing and printed circuit board assembly, such as corner bonding, flip chip, and CSP underfill. The system can be configured with single or dual lanes, and one, two, or three heat stations depending on capacity, process control, and footprint requirements. Its slim system footprint of 600 x 1321mm (23.6 x 52.0 in.) maximizes floor space utilization and lowers cost of ownership. Innovative to the S-920N are a Rapid Response HeaterTMsystem and Controlled Process Heat (CpHTM) function, as well as multiple systems supporting closed-loop dispensing process control.
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