HENKEL: Wafer Backside Coating
The material offers process flexibility, as packaging specialists can now adjust die-attach thickness based on specific manufacturing requirements and can also select their dicing tape of choice. Film die-attach materials are generally supplied in pre-determined thicknesses as a bundled product that incorporates the dicing tape.
Applied via a spray coating method following the wafer thinning process, Ablestik WBC-8901UV is precisely deposited across the back of the silicon wafer, then B-staged using a UV irradiation process. Next, dicing tape is laminated to the wafer, backgrinding tape is removed and the wafer is diced in preparation for die pickup and placement.
For more information, visit www.henkel.com/electronics.