A new heat-curing adhesive can cure to full strength in temperatures as low as 60°C. DELOMONOPOX LT204 epoxy resin reportedly minimizes thermal stress and warping of components being bonded, allowing its use for optical packaging applications, where several temperature-sensitive materials are bound together.

Designed for bonding and casting of compact camera modules, electronic assemblies, mobile assemblies as well as infrared LEDs and image sensors that feature micro-optics, the adhesive reportedly offers low thermal stress and moderate shrinkage during curing. The multi-purpose, one-component adhesive can be processed within 48 hours at room temperature.

 For more information, visit www.delo.de.