A heat-curing adhesive that reportedly cures to full strength in temperatures as low as 60°C is now available. DELOMONOPOX LT204 epoxy resin can minimize thermal stress and warping of components being bonded, making it useful for optical packaging applications, where several temperature-sensitive materials are bound together.

Designed for bonding and casting of compact camera modules, electronic assemblies, mobile assemblies as well as infrared LEDs and image sensors that feature micro-optics, the one-component adhesive reportedly offers low thermal stress and moderate shrinkage during curing.

For more information, visit www.delo-adhesives.com.