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Adhesive & Sealant ProductsFinished Adhesives and SealantsEnd User NewsInfo for ElectronicsInfo for Packaging

DELO: Epoxy Adhesive

DELO Epoxy Adhesive
June 18, 2014

A heat-curing adhesive that reportedly cures to full strength in temperatures as low as 60°C is now available. DELOMONOPOX LT204 epoxy resin can minimize thermal DELO Epoxy Adhesivestress and warping of components being bonded, making it useful for optical packaging applications, where several temperature-sensitive materials are bound together.

Designed for bonding and casting of compact camera modules, electronic assemblies, mobile assemblies as well as infrared LEDs and image sensors that feature micro-optics, the one-component adhesive reportedly offers low thermal stress and moderate shrinkage during curing.

For more information, visit www.delo-adhesives.com.

KEYWORDS: adhesives in electrical/electronic adhesives in packaging epoxies

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