The new DELOMONOPOX AD268 epoxy resin reportedly enables extremely fast production processes and reliability. This anisotropic electrically conductive adhesive is designed for tasks in the RFID industry, but can also be used in other electronic packaging applications.

“Our adhesive has an improved resistance to humidity,” said Jens Amarell, product manager, RFID. “This makes it the ideal solution for applications where reliability is important, such as railway tickets, passports or protection of high-quality products against plagiarism.”

DELOMONOPOX AC268 can be used in chip attach processes, especially in flip-chip applications. It can reliably bond tiny chips, which partly measure only 400 µm, to defined positions on the RFID antenna. 

For additional information, visit www.delo.de.