A new, dual-curing epoxy resin is available that can reportedly be used in the most demanding applications. DELOMONOPOX VE 72768 offers greater bonding accuracy and is resistant to substances like oil, transmission fluid, gasoline, methanol, and printing ink. Designed with special hardeners, the adhesive can be used where bonded or encapsulated components are exposed to extreme temperatures and harsh chemicals.
Curing is reportedly achieved through a two-stage process. First, depending on intensity, the adhesive is light-fixed in up to 5 sec to achieve a die shear strength of more than 1 N on the FR4 circuit board material. Then it is briefly heat cured (for example 30 min at 150°C) to obtain its full strength of 50 MPa on FR4.
For more information, visit www.delo.us.