This company now offers TCP091, Robnor Resins’ silicone-free paste. This new product reportedly has been formulated to provide efficient and reliable heat transfer across the interface between electronic components.

Developed to optimize performance, TCP091 is highly viscous, a property that can help prevent slumping. Since the paste is silicone free, it dissipates without the migration or contamination commonly associated with silicone based products. TCP091 can be easily applied with low amounts of separation in the syringe. As a general-purpose thermal management paste, TCP091 is reportedly a virtually “no-bleed,” versatile compound that will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to 130°C.

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