Hot melts - Articles - Page 17 | Adhesives & Sealants Industry

Bostik Receives Supplier Innovation Award

Bostik recently announced it has received American Packaging Corp.’s (APC) first Supplier Innovation Award.

May 2, 2016

Though the program was created three years ago, APC had not found a supplier for the recognition until this year.

HENKEL ADHESIVE TECHNOLOGIES: Thermally Conductive Adhesive

April 12, 2016

This company has developed a thermally conductive Technomelt material.

ITW Dynatec Receives IDEA Award

March 24, 2016

ITW Dynatec recently announced it will receive a finalist award at the IDEA16 Achievement Awards.

ITW DYNATEC: Hot Melt Supply Unit

March 16, 2016

This company has introduced a newer and more versatile Dynamini™ hot-melt adhesive supply unit (ASU).

Hot-Melt Adhesive System Solution

New melting technology provides savings by eliminating traditional hot-melt challenges.

Nick Long

January 4, 2016

Hot-melt adhesives have played a key role in the packaging process for decades, but traditional technology using heated tanks is less efficient when compared to new systems available today.

UNION TOOL: Laminator

December 23, 2015

A new lamination machine is now available for the expanded polystyrene industry.

Top 5 News that Sticks

Readers Most Interested in Dow and DuPont’s Merger News

Dow and DuPont’s announcement about combining into one company received the most reader interest last week.

Teresa McPherson

December 21, 2015

This weekly roundup highlights the adhesives, sealants and coatings news stories that garnered the most attention during the previous week on our website, as well as our eNewsletter and social media platforms.