Initial reports on the use of ultraviolet (UV) and electron beam (EB) technology for pressure-sensitive adhesives (PSAs) began to appear in the late 1960s.
Packagers and converters are always seeking the most efficient, cost-effective adhesives. Many times, synthetics are not the most reliable solutions. This is especially true in an era when U.S. companies of all types are encouraged to find more environmentally friendly options.
For many people, the glue sticks and glue guns they buy at their local hobby or hardware store are an introduction to hot-melt adhesives—but these products are only a small glimpse of what is possible in the world of hot melts.
Dow Elastomers, a business unit of The Dow Chemical Co., recently announced it will address key industry trends and hot-melt adhesive (HMA) solutions during the FEICA 2014 European Adhesive & Sealant Conference and EXPO.
Considering the massive market size of adhesives and their importance in almost all sectors of materials and applications, boron likely plays a small yet definitive role in the adhesives industry.