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Jowat biobased hotmelt adhesives

JOWAT: Bio-Based Hot-Melt Adhesives

According to Jowat, the products feature high renewable raw materials content, which provides high efficiency and cleanliness during processing while facilitating recyclable bonds according to the German packaging law.
August 20, 2019

Jowat recently announced the launch of its new Jowatherm® GROW product range, comprising bio-based hot melts for the environmentally compatible bonding of packaging.


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Ashland Receives Remaining Regulatory Approvals Related to the Sale of its Composites Business and Butanediol Facility

The companies continue to expect a closing in the late summer of 2019.
August 20, 2019

Ashland Global Holdings Inc. recently announced that it has received the remaining regulatory approvals needed to close the previously announced sale of certain assets of Ashland’s Composites business and butanediol facility in Marl, Germany, to INEOS Enterprises Holdings Limited.


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Case Study

Solving LED Challenges with Silicone Sealants

A silicon sealant coupled with automated dispensing is helping one LED manufacturer enhance product performance and reliability.
August 20, 2019

Based in the UK’s West Midlands, Mackwell Electronics provides technology solutions for the global lighting industry.


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Raised-Hands

ASC Adds Emerging Leaders Workshop to Executive Leadership Conference Offerings

ASC’s interactive new Emerging Leaders Workshop will include facilitated discussion and be structured to optimize learning between peers, providing tools and strategies for leveraging personal strengths and leading change.
August 19, 2019
Consistent with the theme of “Focus on the Future,” the Adhesive and Sealant Council (ASC) is introducing an Emerging Leaders Workshop to its Executive Leadership Conference programming.
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Electronics_Generic

Nordson MARCH Presents Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
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