Finished Adhesives and Sealants

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Bodo Möller Chemie Group and DuPont are celebrating over two decades of trusting cooperation in the service of specialty chemicals.

Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.

With an investment volume of €130 million, the Adhesive Technologies business unit has built a global innovation and customer center on the premises of the company headquarters.

A strategic partnership of four technology companies has resulted in a closed-loop recycling model that is sparking new discussions around the role PET-based multilayer will play in tomorrow’s packaging industry.

According to reports from the National Association of Home Builders (NAHB)/Wells Fargo Housing Market Index (HMI), builder sentiment fell for the ninth straight month in September.

Henkel completed the acquisition of the U.S.-based advanced materials start-up NBD Nanotechnologies Inc.

In times of rapidly increasing energy cost, and rolling blackouts and brownouts, energy input and waste disposal per product unit have become big concerns among manufacturers.

During Huntsman's second quarter earnings conference call, the company provided third quarter adjusted EBITDA guidance of between approximately $310 million and $355 million, excluding Textile Effects.

Dow and Mura Technology announced the next step in an ongoing collaboration to help solve the global plastics waste issue and advance circularity.