Finished Adhesives and Sealants

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The Electronics Group of Henkel recently announced it has named Kevin Becker, Ph.D., to lead its global Product Development and Engineering (PD&E) team.

This company now offers a web-based Product Selector Guide as part of its redesigned website.

In 2007-2011, China’s output of structural adhesives presented a compound annual growth rate of 16.6%, higher than the growth rate of 13.6% of the adhesive industry in the same period.

Dow Corning recently announced it has joined imec, a leading research center for the advancement of nano-electronics.

Royce International recently announced that Vinay Mishra, Ph.D., has joined the company as director of Technology and Business Development.

Semiconductor sales appear to be finally emerging from the red this year, with moderate but steady growth of 5.1% projected through 2014.

At the RUAG Large Subsonic Wind Tunnel, engineers are testing a polyurethane foam cockpit shell developed by Bayer MaterialScience.

The new products from the DELO-KATIOBOND OM family are characterized by minimal curing shrinkage, maximum optical quality, and dimensional stability upon thermal stress.

PPG recently announced that the PPG Industries Foundation has donated $15,000 to the Air Force Museum Foundation for construction of a fourth major building.

Daubert Chemical recently announced its Daubond^®U8508-10 hot-melt polyurethane adhesive has been approved by UL and Intertek as a recognized component in fire-rated steel.