Finished Adhesives and Sealants

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China will displace the U.S. as the largest smartphone market this year, according to a new study from ABI Research.

General Motors and Honda recently announced a long-term, definitive master agreement to co-develop next-generation fuel cell system and hydrogen storage technologies, aiming for the 2020 timeframe.

The Electronics Group of Henkel recently announced it has named Kevin Becker, Ph.D., to lead its global Product Development and Engineering (PD&E) team.

This company now offers a web-based Product Selector Guide as part of its redesigned website.

In 2007-2011, China’s output of structural adhesives presented a compound annual growth rate of 16.6%, higher than the growth rate of 13.6% of the adhesive industry in the same period.

Dow Corning recently announced it has joined imec, a leading research center for the advancement of nano-electronics.

Royce International recently announced that Vinay Mishra, Ph.D., has joined the company as director of Technology and Business Development.

Semiconductor sales appear to be finally emerging from the red this year, with moderate but steady growth of 5.1% projected through 2014.

At the RUAG Large Subsonic Wind Tunnel, engineers are testing a polyurethane foam cockpit shell developed by Bayer MaterialScience.

The new products from the DELO-KATIOBOND OM family are characterized by minimal curing shrinkage, maximum optical quality, and dimensional stability upon thermal stress.