Henkel recently announced it has formed an alliance with DaniMer Scientific LLC, a leader in bio-based material technology, to develop hot-melt adhesives that use bio-based raw materials.
This company has expanded its family of materials for the encapsulation and protection of electronic assemblies and components with its FH1438AB epoxy potting compound.
The accreditation, issued in October 2012, covers enameled ESG, ESG-H and TVG glass panels printed with Dip-Tech inks for bonding with Dow Corning 993 structural glazing sealant.
Appli-tec Inc. recently announced it has reached an agreement with Raytheon Co. to manufacture a family of advanced aerospace-grade adhesives based on Raytheon’s proprietary designs.
This year’s event will provide educational sessions and networking events for manufacturers, distributors, suppliers, and other industry experts from 36 countries.
A new user-friendly website has been launched that can enable visitors to locate adhesives and pressure-sensitive tape solutions for virtually any product application.
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