Adhesive & Sealant Products

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Parker Fluid Control Division, manufacturers of the Skinner and Gold Ring lines of solenoid valves and the Sinclair Collins line of process control valves, now offers a catalog with complete information on its new Angle Body Piston Valve line.

The PPD-130 Peristaltic Pump Dispenser provides "volumetric" dispensing of low-viscosity materials such as cyanoacrylates, oils and solvents without the need for compressed air.

With the Dispercoll S line of products, Bayer MaterialScience AG introduces an assortment of silica gel dispersions that are particularly suitable for the formulation of one-compound aqueous adhesives.

MultiTherm now offers the next generation of heat transfer fluid for its growing base of heat transfer fluid users.

3M has announced the introduction of the 3M Wafer Support System for ultra-thin semiconductor wafer backgrinding.

Bostik Findley Inc. has announced the introduction of Bostik GPS1, a new construction-grade, one-component moisture cure sealant that offers economical high-performance sealing qualities.

DYMAX has created a "Guide to Selecting and Using Light Curing Materials."

Completely redesigned from the ground up, the latest series of Physica MCR rheometers from Anton Paar has been optimized for accuracy and ease-of-use.

The Gordon Research Conference on Science of Adhesion, to be held August 8-13 at Tilton School in Tilton, NH, is set to address several board areas, including materials science, mechanics of solids and surface science.

Brookfield Engineering now offers two choices for "Quick Connect" spindle coupling accessories.