Adhesive & Sealant Products

RSS

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. 

Built for heat, made for speed — Henkel unveils sustainable adhesive for retort and polyolefin packaging.

This all-acrylic latex binder offers enhanced adhesion and durability to facilitate easy installation of luxury vinyl tile systems.

This acrylate-based instant adhesive offers fast-curing time and high adhesive strength on metals and thermoplastics such as ABS and PVC. 

Avery Dennison has combined its proprietary CleanFlake™ adhesive technology, materials science capabilities, and expertise in RFID to develop a new proprietary RFID label that cleanly separates from the PET in the mechanical recycling stream.

Born2Bond™ Ultra K85 from Bostik is an instant engineering adhesive processed from 60% bio-based raw materials that offers exceptional heat and humidity resistance. 

Berquist Liqui Form TLF 6500 CGel-SF is an upgraded thermal curable gel designed to push the envelope of ADAS applications.

LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors. 

Creative Materials Inc. recently launched a series of multi-purpose conductive epoxies that combine flexibility with fine-line precision and extreme durability.

Powerful PUR hot-melt adhesives are essential for the lamination of textiles, nonwovens, foam materials, membranes, and other fabrics.