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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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Daikin: Lowest Extrusion Pressure Fine Powder Product

September 17, 2003
Daikin's F-207 PTFE Fine Powder for paste extrusion runs at high reduction ratios with the lowest extrusion pressure in Daikin's Fine Powder line.
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ABB: New Motor Drive Line

September 17, 2003
ABB Inc. now offers the ACS550 DriveIT Low Voltage AC Drive family.
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Novacel: 9373 Self-Adhesive Film

September 17, 2003
As the demand for innovative industrial surfaces continues to grow, so does the need for dependable surface protection solutions.
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3M: Expanded Line of Urethane Adhesives and Polyurethane Sealants

September 17, 2003
3M's expanded line of Scotch-Weld Urethane Adhesives and Scotch-Seal Polyurethane Sealants offers fast, flexible, and strong bonding and sealing for a wide variety of substrates including metal, wood, concrete, and many plastics.
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Wiley: New Materials Series

September 17, 2003
Consisting of numerous reviews of the field, the first volume in this series, "Macromolecules Containing Metal and Metal-Like Elements Volume 1: A Half Century of Metal and Metalloid-Containing Polymers" offers readers a solid background in the subject through an overview of the discovery and development of these substances.
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Tra-Con: Black Opaque Epoxy Adhesive

September 17, 2003
The Tra-Bond 2126 is a black opaque epoxy adhesive.
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ConProTec Inc.: Nylon Cartridges for Manual Dispensing System

September 17, 2003
ConProTec Inc. announces the availability of Nylon cartridges for its MIXPAC Hand-Held Cartridge Dispensing System for two-component adhesives.
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Limitorque: Master Station II

September 17, 2003
Limitorque, a member of the Flowserve Flow Control, announces the introduction of the Limitorque Master Station II, a master station that is designed and manufactured by Limitorque specifically for use with the Limitorque line of DDC-100 field units.
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Henkel Loctite Corp: Epoxy Molding Compound

September 17, 2003
Henkel Loctite Corp. has introduced Hysol GR725, a semiconductor-grade molding compound designed for use on Power ICs and Power Discrete devices that operate at high temperatures and require good electrical stability.
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Lord Corp: Improved Application Process for Corrosion Control Technology

September 17, 2003
After recently launching the unique MetalJacket metal treatment and coating system for corrosion control of metal parts, Lord Corp. has developed several key process improvements that dramatically reduce the costs and space required to apply the technology.
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June 15, 2026

Adhesive and Sealant Council Executive Leadership Conference

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