Adhesive & Sealant Products - Articles - Page 423

Cambridge Industries of America: High-Temperature Potting Compound

July 26, 2000

This company’s new Hightemp 221FG is a single-component, room-temperature-stable, smooth epoxy potting compound that can withstand continued high-temperature use.

Emerson & Cuming: Electrically Conductive Adhesive

July 26, 2000

This company’s CE 3100 electrically conductive adhesive is a lead-free alternative to solder for surface-mount device (SMD) interconnect formation.

3M: Packaging Adhesives

July 26, 2000

This company’s new packaging adhesives feature a family of 3M™ Jet-melt™ Adhesives and 3M™ Gummy Glue Removable Adhesive.

Bostik: Polymer-Modified CeramicTile Grout

July 26, 2000

This company introduces Hydroment Plus, the first ceramic-tile grout to meet ANSI A118.6 H-4 and A118.7 specifications for polymer-modified grout.

National Starch and Chemical: DUR-O-SET E-150 adhesive copolymer

July 26, 2000

National Starch and Chemical introduces DUR-O-SET E-150 adhesive copolymer.

Paul N. Gardner: Durometer Test Kit

July 26, 2000

The Multi-Scale base kit consists of a Rex A scale durometer, and a choice of one or more color-coded barrel adapters for B, C, D, DO, O or OO scales.

Horiba Instruments: Autosampler

July 26, 2000

This company has introduced a second autosampler option for its LA-Series of particle-size analyzers.

National Starch and Chemical: Hot Melt PSA

July 26, 2000

A new hot melt, pressure sensitive adhesive (PSA) has been formulated to provide better conversion and economy.

CS Hyde: Tapes, Fabrics and Belts

July 26, 2000

This company offers high-performance Teflon® and Kapton® tapes, fabrics and belting that have been designed specifically for longer life and higher output.

TRA-CON: Transparent Epoxy Adhesive

This high-strength adhesive is reportedly designed for industrial and laminating applications that require clarity, as well as excellent structural, mechanical, and electrical properties

July 26, 2000

TRA-BOND 2114 is a low-viscosity, transparent epoxy adhesive formulation.