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FINAT defines low-temperature adhesion as the ability of pressure-sensitive coated material to adhere at temperatures below 5°C. Today, many applications require adhesion that must be maintained at temperatures of -25°C or lower.
The photo curing extent of styrenic block copolymer (SBC)-based adhesive formulations applied as a uniform layer on a Mylar film can be readily determined by Fourier transform infrared spectroscopy (FTIR).
Selecting
the right SBCs for an adhesive formulation allows formulators to develop
specific solutions for various adhesive markets, optimizing cost and
productivity.