FINAT defines low-temperature adhesion as the ability of pressure-sensitive coated material to adhere at temperatures below 5°C. Today, many applications require adhesion that must be maintained at temperatures of -25°C or lower.

The photo curing extent of styrenic block copolymer (SBC)-based adhesive formulations applied as a uniform layer on a Mylar film can be readily determined by Fourier transform infrared spectroscopy (FTIR).