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Home » Authors » Brian Rearick

Brian Rearick

Brian Rearick is the Research Manager of Material Science and Engineering for PPG.

Articles

ARTICLES

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Advancing Adhesives

Structural Adhesive Pushes Performance Boundaries for Composite Armor Systems

A new high-strength and highly ductile adhesive offers performance benefits in the harshest operating environments.
Brian Rearick Marvin Pollum
April 5, 2021

As part of a collaborative project focusing on coatings and joining systems for lightweight materials, the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory (ARL) tasked PPG to develop a high-strength, highly ductile structural adhesive to meet the requirements of the U.S. Department of Defense’s (DoD) test method standard MIL-PRF-32662, Tier I-III specification. MIL-PRF-32662 incorporates a decade of rigorous research efforts to statistically correlate the complex ballistic response of adhesively bonded armor assemblies to universally translatable and commercially relevant quasi-static mechanical properties.


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From Data Silos to AI Success: Lessons from Collano’s Journey

In this webinar, Raphael Schaller, CTO of Collano, shares how his team envisioned their data to make it usable for AI-driven materials discovery. He reflects on what he would do differently if starting over, and how adopting the Citrine Platform has accelerated learning, collaboration, and innovation across the organization.

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