Bonding Symposium Focuses on Improving Adhesion

Our industry is constantly evaluating how to best improve processes and product quality. Toward that end, ASI is serving as media sponsor for Surface TechDays, a one-day symposium that will help attendees understand how to improve adhesion for successful bonding and sealing.

Presentation topics will include “Adhesive Bonding – A Reliable Technology,” “Quality Assurance of Surface Treatment Processes for Adhesive Bonding and Coating Operations,” “Surface PreTreatment without Chemicals and Physical Abrasion through Plasma,” and more.

Surface TechDays will be held October 1 in Detroit, October 2 in Chicago, and October 4 in Minneapolis/St. Paul. To register or for additional information, visit www.SurfaceTechDays.com.