Sun Chemical recently launched a new SunLam solvent-free ultra-low monomer (ULM) adhesive, designed for packaging producers. The adhesive is suitable for high-performance applications that offer a sustainable alternative to existing solvent-based adhesives.

SunLam QA-8000+HA450 is part of Sun Chemical’s proprietary ULM technology. The adhesive extends its capabilities to meet the needs of flexible packaging manufacturers producing high-end applications such as extended boiling-pasteurization, hot-filling, low-retort packaging and products that require improved chemical resistance in acidic or alcoholic environments.

Engineered for high-performance applications, the new product:

• Helps reduce energy consumption and CO₂ emissions, with a VOC-free formulation has no drying requirements on a laminator.
• Supports lightweighting and facilitates mechanical recyclability for mono-material packaging thanks to a lower coating weight compared to solvent-based technology
• Offers easy processability and fast bond strength development
• Features excellent thermal resistance and lay-down on printed substrates

SunLam QA-8000+HA450 has been fully tested in combination with Sun Chemical’s full polyurethane (PU) solvent-based inks technology and also works seamlessly with Sun Chemical’s Aqualam water-based inks to ensure compatibility for retort applications.

“We’re delighted to launch SunLam QA-8000+HA450, which offers packaging producers an energy-efficient alternative that delivers the performance required for high-end packaging. This product underscores our commitment to providing customers with a portfolio that balances efficiency and safety with sustainability demands.  At Sun Chemical, we are proud to offer a range of full PU and non-solvent technologies for adhesive and ink solutions,” said Nicolas Bétin, director of product strategy EMEA, Packaging Inks & Materials at Sun Chemical.

To learn more about Sun Chemical’s solutions, visit https://www.sunchemical.com/packaging_product_sunlam/.