Master Bond Inc. has introduced EP30FL, a new flexible, tough epoxy potting and encapsulation compound. EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low. EP30FL offers excellent adhesion to both similar and dissimilar substrates. Because of its flexibility, it is recommended for use in environments exposed to thermal cycling. EP30FL can also withstand mechanical shock and vibration.

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